View SSM6P35FE_4802425.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SSM6P35FE
TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type
SSM6P35FE
High-Speed Switching Applications Analog Switch Applications
* * 1.2-V drive Low ON-resistance : Ron = 44 (max) (@VGS = -1.2 V)
1.60.05
Unit: mm
1.60.05 1.20.05
: Ron = 22 (max) (@VGS = -1.5 V) : Ron = 11 (max) (@VGS = -2.5 V) : Ron = 8 (max) (@VGS = -4.0 V)
1.00.05 0.5 0.5
1 2 3
6 5 4 0.20.05 0.120.05
1.Source1 4.Source2 2.Gate1 3.Drain2 5.Gate2 6.Drain1
Characteristics Drain-source voltage Gate-source voltage Drain current Drain power dissipation Channel temperature Storage temperature DC Pulse
Symbol VDSS VGSS ID IDP PD(Note 1) Tch Tstg
Rating -20 10 -100 -200 150 150 -55 to 150
Unit V V
ES6
mA mW C C
JEDEC JEITA TOSHIBA
0.550.05
Absolute Maximum Ratings (Ta = 25C) (Common to the Q1, Q2)
2-2N1D
Weight: 3.0 mg (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Total rating Mounted on an FR4 board (25.4 mm x 25.4 mm x 1.6 mm, Cu Pad: 0.135 mm2 x 6)
Marking
6 5 4
Equivalent Circuit (top view)
6 5 4
PZ
1 2 3 1
Q1 Q2
2
3
1
2008-03-14
SSM6P35FE
Electrical Characteristics (Ta = 25C) (Common to the Q1, Q2)
Characteristics Gate leakage current Drain-source breakdown voltage Drain cutoff current Gate threshold voltage Forward transfer admittance Symbol IGSS V (BR) DSS IDSS Vth Yfs Test Condition VGS = 10 V, VDS = 0 V ID = -0.1 mA, VGS = 0 V VDS = -20 V, VGS = 0 V VDS = -3 V, ID = -1 mA VDS = -3 V, ID = -50 mA ID = -50 mA, VGS = -4 V Drain-source ON-resistance RDS (ON) ID = -50 mA, VGS = -2.5 V ID = -5 mA, VGS = -1.5 V ID = -2 mA, VGS = -1.2 V Input capacitance Reverse transfer capacitance Output capacitance Switching time Turn-on time Turn-off time Ciss Crss Coss ton toff VDSF VDD = -3 V, ID = -50 mA, VGS = 0 to -2.5 V ID = 100 mA, VGS = 0 V (Note 2) VDS = -3 V, VGS = 0 V, f = 1 MHz (Note 2) (Note 2) (Note 2) (Note 2) (Note 2) Min -20 -0.4 77 Typ. 4.3 5.6 8.2 11 12.2 6.5 10.4 175 251 0.83 Max 10 -1 -1.0 8 11 22 44 1.2 ns V pF Unit A V A V mS
Drain-source forward voltage
Note 2: Pulse test
Switching Time Test Circuit (Common to the Q1, Q2)
(a) Test Circuit
OUT IN -2.5 V 50 RL VDD 90%
(b) VIN
0V 10%
0
-2.5V
10 s
(c) VOUT
VDS (ON)
90% 10% tr ton toff tf
VDD = -3 V D.U. 1% VIN: tr, tf < 5 ns (Zout = 50 ) Common Source Ta = 25C
VDD
Usage Considerations
Let Vth be the voltage applied between gate and source that causes the drain current (ID) to below (-1 mA for the SSM6P35FE). Then, for normal switching operation, VGS(on) must be higher than Vth, and VGS(off) must be lower than Vth. This relationship can be expressed as: VGS(off) < Vth < VGS(on). Take this into consideration when using the device.
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials.
2
2008-03-14
SSM6P35FE
-250
ID - VDS
Common Source -1000 Common Source VDS = -3V -100 -2.5V Ta = 25C
ID - VGS
-200
-10V
-4V
(mA)
(mA)
Ta = 100C -10 25C -1 -25C
ID
Drain current
-100 -1.5V -50
Drain current
-1.8V
ID
VGS=-1.2V
-150
-0.1
0 0 -0.5 -1 -1.5 -2
-0.01 0
-1
-2
-3
Drain-source voltage
VDS
(V)
Gate-source voltage
VGS
(V)
RDS (ON) - VGS
20 Common Source ID = -5 mA 15
RDS (ON) - VGS
Common Source ID = -50 mA
Drain-source ON-resistance RDS (ON) ()
15
Drain-source ON-resistance RDS (ON) ()
10
10 25 5 Ta=100
25 5 Ta=100
-25 0 0 -2 -4 -6 -8 -10 0 0 -2 -4 -6 -8
-25
-10
Gate-source voltage
VGS
(V)
Gate-source voltage
VGS
(V)
RDS (ON) - ID
20 Common Source Ta = 25C 20 Common Source
RDS (ON) - Ta
Drain-source ON-resistance RDS (ON) ()
Drain-source ON-resistance RDS (ON) ()
15 VGS = -1.2 V 10 -1.5 V -2.5 V 5 -4 V
15
VGS =-1.2 V, ID=-2mA -1.5 V, -5mA
10
-2.5 V, -50mA
5
-4V, -50mA
0
-1
-10
-100
-1000
0 -50
0
50
100
150
Drain current
ID
(mA)
Ambient temperature
Ta
(C)
3
2008-03-14
SSM6P35FE
Vth - Ta
-1
Yfs - ID (mS) Yfs Forward transfer admittance
100 10 Common Source ID = -1 mA VDS = -3 V 1000
Vth (V) Gate threshold voltage
-0.8
-0.6
-0.4
-0.2
Common Source VDS = -3 V Ta = 25C 1 -1 -10 -100 -1000
0 -50
0
50
100
150
Ambient temperature
Ta
(C)
Drain current
ID
(mA)
IDR - VDS
1000 Common Source VGS = 0 V 100 G 10 S 1 Ta=100 0.1 -25C 25C D IDR 100
C - VDS
IDR
(mA)
Drain reverse current
C
10
(pF)
Capacitance
Ciss Coss Crss Common Source VGS = 0 V f = 1 MHz Ta = 25C -1 -10 -100
0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4
1 -0.1
Drain-source voltage
VDS
(V)
Drain-source voltage
VDS
(V)
t - ID
Common Source VDD = -3 V VGS = 0 to -2.5 V Ta = 25C
PD *- Ta PD * (mW)
250 Mounted on FR4 board. 2 (25.4 mm x 25.4 mm x 1.6 mm, Cu Pad: 0.135 mm x 6) 200
10000
(ns)
toff 1000
Drain Power Dissipation
t
150
Switching time
tf
100
100
ton tr
50
10 -0.1
-1
-10
-100
-1000
0 0 20 40 60 80 100 120 140 160
Drain current
ID
(mA)
*:Total Rating
Ambient temperature
Ta
(C)
4
2008-03-14
SSM6P35FE
RESTRICTIONS ON PRODUCT USE
* Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
5
2008-03-14

▲Up To Search▲

Price & Availability of SSM6P35FE

	To Download SSM6P35FE Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .